tech economics - Janmuse

The Packaging Trap: Why TSMC Controls the AI Future

October 18, 202618 min read

We are told the AI revolution is driven by software and algorithmic innovation, but the reality is far more industrial. As hyperscalers race to build massive GPU clusters, they are all hitting a physical wall: TSMC’s CoWoS packaging. With capacity set to double by 2028, we explore why advanced packa

Special Press

The Physical Ceiling: Why AI Scaling Just Hit a Wall

October 17, 202617 min read

We treat AI as a cloud-based revolution, but the reality is built on heavy fiber cables and concrete slabs. As hyperscalers scramble to link massive data centers, they are running head-first into a growing movement of municipal resistance. From the $20B Corning-Verizon deal to the local zoning battl