Semiconductor industry

The Packaging Trap: Why TSMC Controls the AI Future

October 18, 202618 min read

We are told the AI revolution is driven by software and algorithmic innovation, but the reality is far more industrial. As hyperscalers race to build massive GPU clusters, they are all hitting a physical wall: TSMC’s CoWoS packaging. With capacity set to double by 2028, we explore why advanced packa

Special Press

The Fiber Bottleneck: Rewiring the AI Data Center

October 18, 202616 min read

As AI workloads push GPU clusters to their thermal and speed limits, the biggest bottleneck in AI isn't raw compute—it’s the interconnect. From Corning's massive manufacturing surge to Verizon’s multi-billion dollar infrastructure pivot, we look at the race to replace copper with light, re-engineeri